E. Common Infrastructures Research and Development of Electronic Component Technologies for Space Environments

Electronic components used in spacecraft must operate reliably under harsh conditions from launch through orbital insertion.

To support flexible, continuous space activities and strengthen the future competitiveness of satellite systems, this research advances the development of highly reliable, space-grade components essential to satellite operations. It also builds expertise in the effective use of commercial technology-based components while verifying their robustness in space environments.

From a long-term perspective, JAXA works with research institutions and industry partners to identify promising domestic technologies. Priority is given to components expected to substantially improve future satellite systems, with the aim of accelerating their transition from research to practical application.

Prototype 16-nm FinFET semiconductor chip
with radiation-hardened circuits

RF-MEMS switch array prototyped
using “Minimal fab”.

Significance of the Research

A large satellite is estimated to require several hundred thousand to one million space-grade components. Such components are indispensable for assembling spaceborne electronic systems; without a complete and reliable parts supply, satellite integration cannot be completed.

Because system performance is constrained by the capabilities of its constituent components, component performance defines the upper limit of overall satellite performance. Improving space-grade components is therefore essential to enhancing satellite functionality.

Through the strategic selection and development of critical components, this research supports flexible space activities and strengthens the international competitiveness of future satellite systems.

Research Objectives

Our R&D focus on components that critically influence satellite functionality and performance. The objectives are organized into four strategic categories of space components:

Radiation-Tolerant Use of Advanced Component Technologies in Space

This research focuses on understanding and characterizing the effects of space radiation—one of the most critical environmental factors—on advanced electronic components.
JAXA aims to systematically establish technologies and expertise for:

Identifying and analyzing radiation effects
Ensuring and enhancing radiation tolerance
Predicting on-orbit behavior
Conducting testing and analytical evaluations

These efforts will expand the range of electronic components available for spacecraft and thereby strengthen international competitiveness.

Irradiation testing of semiconductor devices (left) and

High-Performance Spaceborne Computing Device Technologies

High-Performance Spaceborne Computing Device Technologies
Ultra-low power consumption
Functional integration of analog and digital elements
High-speed signal transmission combining photonics and electronics

Building on previously developed technologies, including microprocessors and nano-bridge FPGAs, the focus is on maximizing their performance potential.
These advancements are expected to improve onboard computing performance and enable component miniaturization by simplifying system configurations and thermal-management requirements.

Power Device Technologies for High-Precision Power System Control

Spacecraft are increasingly adopting high-power systems comparable to those used in automotive and railway applications. Power devices—semiconductor components at the core of power control—are essential to this transition.
Accordingly, compound semiconductor technologies such as SiC and GaN, which are also emerging in terrestrial industries, are indispensable. This research aims to:

Develop space-compatible compound semiconductor chips with superior environmental tolerance
Establish operating conditions ensuring long-term reliability
Develop packaging and mounting technologies that enhance fault tolerance

These efforts will support high-power control in space systems while enabling compact, highly reliable power components.

High-Density Packaging Technologies to Maximize Component Performance

Recent advances in component technologies have led to:

Low-voltage, high-current operation in computing devices
GHz-class high-frequency operation
High-voltage, high-current power devices

This research focuses on supporting technologies—such as passive components, substrates, and packaging—that can accommodate these advancements.
These technologies will allow high-performance components to be used without limiting operating speed or temperature range, thereby contributing to diverse future missions.